Active and preferred
RoHS Compliant
Lead-free

2EDF7275K

Fast, robust, dual-channel, functional isolated MOSFET gate drivers with accurate and stable timing
Data Sheet
package
board
ea.
in stock

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2EDF7275K
2EDF7275K
ea.
Data Sheet

Product details

  • Budgetary Price €/1k
    0.97, 0.97
  • Channels
    2
  • Configuration
    Half Bridge, High-side and low-side, High-side
  • Input Vcc
    3 V to 3.3 V
  • Input-side supply
    20 V
  • Isolation Type
    Galvanic isolation - Functional
  • Output Current (Sink)
    8 A
  • Output Current (Source)
    4 A
  • Package
    LGA13 5mmx5mm
  • Qualification
    Industrial
  • Turn Off Propagation Delay
    37 ns
  • Turn On Propagation Delay
    37 ns
  • VBS UVLO (On)
    4.2 V
  • VBS UVLO (Off)
    3.9 V
  • VCC UVLO (On)
    2.85 V
  • Voltage Class
    250 V
Recommended
OPN
2EDF7275KXUMA2
Product Status active and preferred
Infineon Package
PG-TFLGA-13
Package Name N/A
Packing Size 4000
Packing Type TAPE & REEL
Moisture Level 3
Moisture Packing DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:
 ea. in stock

Product Status
Active
Infineon Package
PG-TFLGA-13
Package Name -
Packing Size 4000
Packing Type TAPE & REEL
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock
The EiceDRIVER™ 2EDF7275K is a functional isolated gate driver designed for high-performance DC-DC medium-voltage, half- and full-bridge topologies. The 4A/8A source/sink currents, combined with a short 37ns propagation delay and highly accurate temperature and production timing, are perfectly suited to high frequency PWM control. The low impedance of the gate driver output stages keeps the driver package and PCB cooler, which is a key benefit.

Features

  • Fast power switching with accurate timing
  • Optimized for area and low cost system BOM
  • Robust design against switching noise
  • Output- to-output channel isolation
  • Input-to-output channel isolation

Benefits

  • Efficiency gain and lower losses
  • Improved thermal behavior at smaller form factor
  • Protection and safe operation
  • Flexible configurations
  • Regulatory safety

System values

  • Enabling higher system efficiency and higher power density designs
  • Improving cost position, integration and mass manufacturability
  • Extending end-product lifetime by improving safe operation of power switches and reliable PWM communication and PWM signal chain in abnormal conditions
  • Lowering EMI by ground isolation, driver proximity to MOSFETs or use of Kelvin Source MOSFETs
  • Meeting all isolation requirements of standard DC-DC equipment

Diagrams

2EDi_EiceDRIVER_DevicePinAssignments_2EDF72xxK
2EDi_EiceDRIVER_DevicePinAssignments_2EDF72xxK
2EDi_EiceDRIVER_DevicePinAssignments_2EDF72xxK 2EDi_EiceDRIVER_DevicePinAssignments_2EDF72xxK 2EDi_EiceDRIVER_DevicePinAssignments_2EDF72xxK
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